Texas Instruments TMS320C6722 Manuel d'utilisateur télécharger pdf (Page 107)

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7 Mechanical Data

7.1 Package Thermal Resistance Characteristics

TMS320C6727, TMS320C6726, TMS320C6722

Floating-Point Digital Signal Processors

SPRS268E – MAY 2005 – REVISED JANUARY 2007

Table 7-1 and Table 7-2 provide the thermal characteristics for the recommended package types used on

the TMS320C672x DSP.

Table 7-1. Thermal Characteristics for GDH/ZDH Package

AIR FLOW

NO. ° C/W

(m/s)

Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB

1 R θ

Thermal Resistance Junction to Ambient 25 0

2 R θ

Thermal Resistance Junction to Board 14.5 0

3 R θ

Thermal Resistance Junction to Top of Case 10 0

4 Ψ

Thermal Metric Junction to Board 14 0

5 Ψ

Thermal Metric Junction to Top of Case 0.39 0

Table 7-2. Thermal Characteristics for RFP Package

THERMAL PAD CONFIGURATION

AIR

NO. ° C/W FLOW

VIA

TOP BOTTOM

(m/s)

ARRAY

Two-Signal, Two-Plane, 76.2 x 76.2 mm PCB

(1) (2) (3)

1 R θ

Thermal Resistance Junction to Ambient 10.6 x 10.6 mm 10.6 x 10.6 mm 6 x 6 20 0

7.5 x 7.5 mm 7.5 x 7.5 mm 5 x 5 22 0

2 Ψ

Thermal Metric Junction to Power Pad 10.6 x 10.6 mm 10.6 x 10.6 mm 6 x 6 0.39 0

Double-Sided 76.2 x 76.2 mm PCB

(1) (2) (4)

3 R θ

Thermal Resistance Junction to Ambient 10.6 x 10.6 mm 10.6 x 10.6 mm 6 x 6 49 0

10.6 x 10.6 mm 38.1 x 38.1 mm 6 x 6 27 0

10.6 x 10.6 mm 57.2 x 57 mm 6 x 6 22 0

10.6 x 10.6 mm 76.2 x 76.2 mm 6 x 6 20 0

4 Ψ

Thermal Metric Junction to Power Pad 10.6 x 10.6 mm 10.6 x 10.6 mm 6 x 6 0.39 0

(1) PCB modeled with 2 oz/ft

Top and Bottom Cu.

(2) Package thermal pad must be properly soldered to top layer PCB thermal pad for both thermal and electrical performance. Thermal pad

is V

(3) Top layer thermal pad is connected through via array to both bottom layer thermal pad and internal V

plane.

(4) Top layer thermal pad is connected through via array to bottom layer thermal pad.

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